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CfT: LA3215C-UCC-CFT for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots

Tender submission deadline in (days/hours):
27/2
Name of Contracting Authority:
Education Procurement Service (EPS)
Title:
LA3215C-UCC-CFT for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots
CfT CA Unique ID:
LA3215C
Evaluation Mechanism:
Most Economically Advantageous Tender (MEAT)
Allow different Evaluation Mechanism in the MC/SC:
Description:
Tenders are sought for the supply delivery, installation and commissioning of a suite of tools in 4 Lots for silicon-based and dielectric materials for University College Cork. The new plasma tools will enhance the capabilities at the Tyndall National Institute for the fabrication of semiconductor devices, especially silicon microelectronics and silicon MEMS, but also other materials such as germanium and silicon carbide. We invite proposals for the following lots; Lot 1 Plasma Etcher Silicon Dielectrics, advanced plasma etching system capable of etching for polysilicon poly-Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 2 Plasma Etcher Metals Piezoelectrics, advanced plasma etching system capable of etching for aluminium Al and alloys molybdenum Mo aluminium scandium nitride AlScN thin films using medium high-density plasma processes. Lot 3 Plasma Etcher Slow and Controllable Rate Atomic Layer Etch for Silicon Dielectrics, advanced plasma etching system capable of both conventional high-rate etching and slow and controllable rate atomic layer etching for silicon Si silicon dioxide SiO2 silicon nitride SiN thin films using medium high-density plasma processes. Lot 4 Plasma Deposition PECVD, advanced plasma enhanced chemical vapour deposition system capable of depositing dielectric SiO2, SiN and amorphous a-Si thin films on semiconductor substrates. This equipment will be essential for etching and depositing a range of materials used in the fabrication of silicon microelectronics, silicon photonics and silicon MEMS devices. The ideal tools will offer precision, reliability, and efficiency to meet the requirements for etching and deposition on both 100 mm and 200 mm diameter wafers. Tenderers with cutting-edge solutions that can achieve these high standards are encouraged to submit their proposals for this vital component in our technological advancement.
Procurement Type:
Supplies
Directive:
2014/24/EU (Classic)
Procedure:
Open
CfT Involves:
A Public Contract
CPV Codes:
38000000-Laboratory, optical and precision equipments (excl. glasses)
Award per Item:
Yes
Inclusion of e-Auctions :
No
NUTS codes:
IE
Estimated value (EUR):
3,300,000
Above or Below threshold:
Above
Time-limit for receipt of tenders or requests to participate:
17/07/2026 12:00
Deadline for dispatching invitations:
End of clarification period:
07/07/2026 12:00
Tenders Opening Date:
17/07/2026 12:30
Allow suppliers to make an online Expression Of Interest:
Yes
Contract awarded in Lots:
Yes
Number Of Lots:
4
Lot Name(1)
Plasma Etcher ,Silicon ,Dielectrics   Award per Item: No
Lot Name(2)
Plasma Etcher ,Metals ,Piezoelectrics   Award per Item: No
Lot Name(3)
Plasma Etcher ,Slow and Controllable Rate ,Atomic Layer Etch for Silicon , Dielectrics   Award per Item: No
Lot Name(4)
Plasma Deposition ,PECVD   Award per Item: No
Tenders For Lots:
Maximum Number of Lots
Maximum Number of Lots:
4
Contract duration in months or years, including any options and renewals:
48 months
Validity of Tender in days or months:
180 days
EU funding:
No
Multiple tenders will be accepted:
Yes
Date of Publication/Invitation:
17/06/2026 03:14
TED links for published notices:
https://ted.europa.eu/udl?uri=TED:NOTICE:415187-202...
Date of Awarding:
Language of publication:
EN
Number of openers:
Two